Description
LGA1150 socket for 4th Generation Intel®Core™ i7/ i5/ i3/ Pentium® / Celeron® ProcessorsIntel® Z87 Express ChipsetTUF Fortifier - Bolsters boards against bending damageThermal Armor with Flow Valve - Total airflow-boosting heat dissipationThermal Radar 2 - Complete system cooling, customized fan tuningDust Defenders - Repel the dust, expand the lifespanTUF Components [10K Ti-Cap, Alloy Choke & MOSFET; certified by military-standard] – Certified for tough dutyTactical Armor, Fortified ReliabilityThe TUF series delivers a "tough" image. With the unique design & high quality components (military-standard), TUF series is born for pursuing the preeminent stability, all-round compatibility, and extreme durability. TUF FortifierTUF Fortifier adds a strong backplate so the motherboard doesn't buckle under the weight of heavy graphics cards and CPU coolers. Reduced PCB bowing and bending means an end to potentially damaged circuitry. With a thermal pad directing heat away from VRM and other key components, TUF Fortifier combines great strength and cooling.Prevent BendingTUF Fortifier can handle more weight than that of really heavy CPU coolers and graphics cards, giving you a huge safety margin. Even the largest and heaviest can be installed with no risk of causing motherboard PCB stressing.Enhanced Heat ConductionTUF Fortifier uses a thermal pad attached to the motherboard, directing heat away from key components such as VRMs and MOSFETs, enhancing system cooling. TUF Fortifier also protects DIY builders from solder pins and other sharp motherboard parts – preventing annoying cuts!Thermal Armor with Flow ValveCovers the entire board and features dual fans to direct cool air to critical parts and dissipate heat faster for better stability. Drastically boosts airflow and cooling with dual fans and a smart shunt design that directs hot air away from critical components. Air power is improved with a back I/O fan that pulls in cold air and expels even more heat. Exclusive flow valve design controls heatpipe air contact, better-utilizing liquid cooling setups.Flow ValveNew generation Thermal Armor features an exclusive flow gate design. In open state, the flow valve allows cool airflow from downdraft fans into Thermal Armor, maximizing airflow for fan-based thermal setups. When closed, it focuses air on high-efficiency heatpipes for faster heat removal. This is especially useful for liquid cooling. This flexibility was created to cater to different cooling arrangements, and make the most of all.Convection HolesOpenings in the board are strategically-placed to improve air circulation and ensure effective cooling reaches under the board. PCB convection holes lower in-case temperatures, adding to system stability and endurance.Thermal Radar 2With multiple onboard sensors and bundled thermistor cables, you can real-time monitor temperatures for areas around key components other than the motherboard itself. Customizable fan control gives you the flexibility of adjusting fan speeds manually and achieving optimal thermal tuning with one click.Thermal TuningThermal Radar 2 provides whole system fan optimization with a single click. This achieves the best cooling for your components beyond just the mere number of fans in your case. Based on the characteristics of each fan connected to your motherboard, all fan profiles can be quickly optimized. Fan ControlGives customized settings for each fan, which can be easily changed. You can supervise fan speeds to balance cooling and noise emissions, and fans can be manually managed, individually controlled, and even named. All these promote better cooling, noise reduction, and power saving. Thermal StatusThermal status reports show CPU and VGA area temperatures in real-time with smart thermal capacity evaluations for CPU and VGA zones. CPU thermal assessment gauges temperature rises with increasing voltage, providing a benchmark to judge your CPU cooler’s performance.Dust DefendersTUF design
